IMAPS UK MicroTech 2009 - Bio-Sensors and MEMS Packaging
Tuesday, 3 March 2009

Fellow Practitioners in Microelectronics Technologies.

IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.

We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals.

Abstracts were due 31 October 2008. If you have questions about the programme or speaking opportunities, please contact the Secretariat of IMAPS-UK (imapsuk@aol.com).

Basic Packaging Workshop (BPW)
Thursday 4 December 2008

Hosted by:  UNISEM, South Wales - NP11  3XT
Device packaging is now the cornerstone of the industry and is a key skill now needed by managers, engineers and technicians in the electronics chip design, development and manufacturing market as well as University academics and Institute professionals.

An Opportunity to gain knowledge and understanding about the basic technology holding Electronic systems together. A day workshop covered the 4 main topics of:

• Package trends and technologies including a Market briefing and an insight into Package technology trends and developments.
• Mounting Die including work on Die prep and Epoxy / Eutectic materials and processes.  
• Die Interconnection, covering the Ins & outs of wirebonding, Flip chip and die stacking. 
• Test verification & Reliability looking at pull/Shear test equipment and general Package testing.

There was also a Factory - Window Tour of the UNISEM facility.

Programme

9.00 am – Registration
9.30 – 10.30 Session 1 - Package trends and technologies
            a) Market briefing – Andy Longford, PandA Europe
            b) Package technology trends and developments.  -  UNISEM
11.00 – 12.00 Session 2 - Mounting Die
            a) Die prep – John Sweet,  LOADPOINT
            b) Epoxy / Eutectic materials and processes. – Mark Currie, HENKEL
12.00 – 12.30 Factory Tour
Lunch break
1.30 – 2.30 Session 3 - Die Interconnection
            a) Ins & outs of wirebonding – Hugh de Lacy, TS2 Micro
            b) Flip chip and die stacking. – TWI
3.00 – 4.00 Session 4 - Test verification & Reliability
            a) pull/Shear test equipment -  Dr Stephen Clark, DAGE
            b) Package testing. – Iain Gardiner, WAFERDATA
Close  

MicroTech 2008
10th - 11th June 2008
MicroTech 2008 Moves to Larger Venue!

MicroTech 2008 was held in the Balmoral suite at Beaumont House, which is a totally self contained conference block with the conference room on the first floor and the exhibition and food area on the ground floor. The new venue could accommodate up to 180 delegates and 30 exhibitors

MicroTech 2007 -- Advanced Interconnection
6-7 March 2007
Includes Tabletop Exhibition, Conference Dinner
Hellidon Lakes - Daventry, Northamptonshire

Annual General Meeting of IMAPS-UK 2007
The Annual General Meeting of IMAPS-UK was held on 6 March 2007 at MicroTech 2007 at Hellidon Lakes - Daventry, Northamptonshire.

Interconnection Technology Seminar at MTEC 2007
14 February 2007
NEC - Birmingham